| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a semiconductor package and to exactly and smoothly input/output high frequency signals between a semiconductor device and an external electric circuit at high speed while reducing at transmission loss. SOLUTION: An input/output terminal 3 is composed of a plate part 3a having a line conductor 3b formed on an upper surface from one side to the other counter side, and a ground conductor layer 3c formed on both the sides and a rising wall part 3d bonded on the upper surface of the plate part 3a while interposing the line conductor 3b and the ground conductor layer 3c, and the line conductor 3b is made into two differential lines formed as one set of input lines and/or output lines. In respect to thickness (t) of the plate part 3a, a gap G between two differential lines is made into 0.5 mm<=G<=t, a gap W between the line conductor 3b and the ground conductor layer 3c is made into the relation t/2<=W<=3t, and the electric resistance rate of the line conductor 3b and the ground conductor layer 3c is <=1.5×10-3 Ωm. |
