| 摘要 |
PROBLEM TO BE SOLVED: To ensure insulating properties between a lead frame and a heat sink. SOLUTION: A semiconductor device comprises a lead frame 1; a power semiconductor chip 2 and a control semiconductor chip 3 mounted on the lead frame; first wires 4 and second wires 5 which electrically connect the power semiconductor chip and the control semiconductor chip with the lead frame, respectively; and a heat sink 7 formed on the surface of the lead frame opposite to the semiconductor chip mounting surface, with an insulating layer 8 between. At least part of the heat sink is away from the lead frame. |
