| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein a multilayer wiring board composed of an organic material cannot satisfy the high density, the insulating property, the continuity reliability and the high-frequency transmission characteristic of an interconnection. SOLUTION: In the multilayer wiring board 4, a plurality of insulating films 1 which are composed of the organic material and in which a wiring conductor 2 composed of a metal foil is arranged and installed on at least one face from among the surface and the rear surface are laminated and formed, and wiring conductors 2 which are situated in the upper part and the lower part by sandwiching the insulating films 1 are electrically connected via through conductors 3 formed in the insulating films 1. Each insulating film 1 is formed in such a way that coating layers 6 composed of an epoxy resin are formed on the surface and the rear surface of a liquid crystal polymer layer 5. It is possible to form the board 4 whose insulating property, continuity reliability and high-frequency transmission characteristic are superior. |
