发明名称 PLATING ADHESION QUANTITY CONTROL SYSTEM AND PLATING ADHESION QUANTITY CONTROL METHOD
摘要 PURPOSE: A plating adhesion quantity control system is provided to control quantity of zinc adhered to the strip to a target adhesion quantity of zinc by ejecting high pressure gas onto the strip from air knife nozzles after dipping a strip continuously moved into a hot dip galvanizing pot, and a plating adhesion quantity control method is provided. CONSTITUTION: In a plating adhesion quantity control system of a plating line(150) for plating a strip(151) produced in the steel cold rolling process, the system comprises a controlling calculation part(140) for storing a preset target plating adhesion quantity data, and outputting the calculated set value by calculating a target plating adhesion quantity set value; a plating control part(100) into which the target plating adhesion quantity set value is inputted from the controlling calculation part, and which is equipped with a plating observation part for observing plating quantity adhered to the strip discharged from the plating line to output a plating control signal by obtaining a deviation between the target plating adhesion quantity set value and observed plating adhesion quantities and performing a certain operation expression according to the deviation, thereby calculating a plating control quantity; and air knife nozzles(155) for controlling plating quantity adhered to the strip coming out of plating pot(153) of the plating line by controlling amount of gas injected after receiving the control signal from the plating control part, wherein the controlling calculation part comprises plating adhesion quantity setting table(143), set value calculation means(142), plating specification table(141) and telecommunication interface part(144), and wherein the plating control part comprises telecommunication interface part(101), observation means(103), observation control means(104) and correction coefficient calculation means(107).
申请公布号 KR100380728(B1) 申请公布日期 2003.04.04
申请号 KR19960071537 申请日期 1996.12.24
申请人 POSCO;HITACHI, LTD. 发明人 KIM, DAE HYEOK;KIM, WON BONG;HOSHI, TETSUYA
分类号 C23C2/20;(IPC1-7):C23C2/20 主分类号 C23C2/20
代理机构 代理人
主权项
地址