| 摘要 |
PROBLEM TO BE SOLVED: To enable bonding with a small loop height by shortening the length of a recrystallized part of a conductive wire. SOLUTION: A method for wire bonding comprises: the first process that a voltage necessary for dielectric breakdown between an ignition electrode 12 and a tip of a wire 1 is impressed to them in between; the second process that a voltage necessary for maintaining a discharge current value A1 needed to form a metal ball 2 is impressed; and the third process that a discharge current value A2 necessary for maintaining a state where the metal wire 1 is melted and a small discharge current value A3 necessary for maintaining the discharge are turned on by alternately switching the currents. |
