| 摘要 |
PROBLEM TO BE SOLVED: To obtain a high-density printed-wiring board by manufacturing a printed wiring board in which extremely thin wires having a line/space = 30/30μm or less are formed, and by manufacturing a pattern whose copper-foil adhesive force is superior and whose shape is satisfactory. SOLUTION: An extremely thin copper foil in which a through hole and/or a blind via hole are formed and whose copper foil thickness on the other layer is 5μm or less is used, preferably, a copper electroless plated layer in 0.1 to 3μm is executed, a copper electroplated layer in 0.5 to 3μm is then executed, a positive plating resist is bonded, a copper electroplated film in 6 to 30μm is then bonded, the plating resist is stripped, the thin copper electroplated layer, the copper electroless plated layer and the extremely thin copper foil layer are dissolved and removed, and the pattern in the line/space = 30/30μm or less is formed. Consequently, it is possible to obtain the high-density printed- wiring board in which a copper pattern undercut is small and which is superior in the copper-foil adhesive force. |
