| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem which may arise when a plurality of electronic components are mounted on metal circuit boards on a ceramic circuit board through solder, the problem that the solder flows to cause the displacement of mounted electronic components, and thus the accuracy of position in wire bonding fluctuates, to binder correct connection between the electronic components and the ceramic circuit board by wire bonding and makes it impossible to normally operate the electronic components mounted on the metal circuit boards. SOLUTION: A ceramic circuit board is provided with through holes 8 which are positioned between the areas of metal circuit boards 4 where electronic components 7 are mounted through solder 6 and which prevent spread of the solder 6. The through holes are positioned 0.1 mm or more away from the outer edges of the electronic components 7 mounted through the solder 6, and the width of the holes is preferably between 0.3 mm and 0.8 mm inclusive.</p> |
