| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket in which pasting between a soldering ball and a contact can be solved by a simple structure. SOLUTION: The IC socket is provided with at least a slider to reciprocate on a circuit board in a horizontal direction accompanied with a vertical movement of a cover, package guides installed at four corners of the slider and to guide the IC package and also to determine the position of the IC package, and a contact having a fixed contact pin fixed to the circuit board and a moving contact pin to open-close accompanied with the reciprocal movement of the slider. When the contact pin opens and the soldering ball of the IC package is received between the fixed contact pin and the moving contact pin, a clearance between the outer boundary of the IC package and the package guide is set to be smaller than that between the soldering ball of the IC package and the two contact pins.
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