| 摘要 |
PROBLEM TO BE SOLVED: To provide a package realizing an optical semiconductor module in which the size and power consumption can be reduced by reducing inflow of heat from the outside of the package as much as possible. SOLUTION: A package 10 for an optical semiconductor module comprises a frame 11 and a cover 14 formed of a material having a low thermal conductivity and a low thermal expansion coefficient, and a heat sink 13 formed of a material having a high thermal conductivity and a low thermal expansion coefficient. Since the frame 11 and the cover 14 are formed of a material having a low thermal conductivity, heat on the outside of the package 10 can be prevented from flowing through the frame 11 and the cover 14 even if the inside of the package 10 is cooled down below the room temperature. Furthermore, since the heat sink 13 is formed of a material having a high thermal conductivity, heat generated in the package 10 can be discharged efficiently to the outside. Consequently, the size and power consumption of the optical semiconductor module can be reduced.
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