| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can minimize breakage of an apparatus under a leakage current, in a wiring board where a circuit pattern and a ground line are formed on an insulating board while the surface of the insulating board is covered with an insulating layer. SOLUTION: A circuit pattern of a conductive material is formed on an insulating board. A ground line of a conductive material is formed in the vicinity of a prescribed circuit pattern. The entire section in which a ground line is formed, or a region excluding a part of it is covered with the insulating layer. |
