| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for predicting the substrate temperature at the time of reflow heating step for obtaining a temperature condition which does not bring about a damage or the like at a circuit substrate by a simple method when a lead-free solder having a high melting temperature is used. SOLUTION: The method for predicting the substrate temperature at the time of reflow heating step comprises the steps of assuming that the circuit substrate which is actually moved by a conveyor is stopped in a reflow heater, so that a heating temperature changes in response to a time change and modeling it, building a model equation by assuming that an energy input and output balance is a component temperature rise value = (a heat quantity from an atmosphere) + (a heat quantity by a radiation of the reflow heater), analyzing the model equation by a finite difference method, and calculating the temperature corresponding to the substrate position. |
