NONCONTACT COMMUNICATION MEDIUM

摘要

PROBLEM TO BE SOLVED: To provide a small-sized noncontact communication medium with excellent bending resistance. SOLUTION: An IC module part having an IC bare chip 2 and a chip capacitor 4 sealed by sealing resin such as epoxy resin mounted on the polyimide substrate 1 thereof and a function part having an antenna coil 5 for transmission and receiving are fixedly held by ET-G films 6 from upper and lower sides to provide a primary formed body M. An elastic body 7 such as a felt of 80 or less in Shore hardness having a hole of generally same size as the primary formed body M is prepared, and the primary formed body M is inserted into the hole of the elastic body 7. Then the PET-G films 8 and 8a are thermally pressed from both sides for stacking. Thus a noncontact IC tag T can be provided.