| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-formation treatment apparatus which can form a uniform film without being influenced by an error in terms of a structure. SOLUTION: In the film-formation treatment apparatus, a film-formation treatment is performed to, e.g. a treatment face on a semiconductor wafer 1 as an object to be treated. In the apparatus, a plumb bob ring 150 which is connected to a clamp ring 5 by shafts 7 as a plurality of connection parts installed at equal intervals and whose center of gravity is identical to that of the clamp ring 5 is provided at the lower part of the clamp ring 5 used to clamp the peripheral edge part of the treatment face on the semiconductor wafer 1, the clamp ring 5 and the ring 150 are moved simultaneously when they are moved up and down in order to clamp the semiconductor wafer 1, and the semiconductor wafer 1 is clamped by the clamp ring 5, the shafts 7 and the own weight of the ring 150.
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