| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem associated with multiple-lead lead frames that the width of a multiple-lead lead frame is small and thus the connecting strength of wires for electrically connecting a semiconductor pellet with leads may be insufficient. SOLUTION: In a lead frame 10, an island 2 on which a semiconductor pellet 4 is mounted and a large number of inner leads 11 the one-side ends of which are coined and arranged along the island 2, are joined and integrated with each other. Coining portions 11b and 11c stepwise different in depth are formed in the areas of the inner leads 11 extending from the one-side ends to the middle portions thereof.</p> |
