发明名称 WAFER ALIGNER
摘要 <p>PROBLEM TO BE SOLVED: To provide an aligner for aligning a wafer continuously in which positional shift of the wafer is prevented by grasping the wafer surely at the edge thereof. SOLUTION: The aligner 1 comprises a machine base 10, a delivery arm part 20 of a wafer 3, and a holding clamper 30. The delivery arm part 20 having lower stage claw parts 221 and 231 and upper stage claw parts 222 and 232 constituting a buffer stage is arranged to rotate by a specified angle through a shift angle rotary drive section 13 and the holding clamper 30 is arranged to elevate/lower through an elevating/lowering drive section 15 and to open/close through an open/close drive section 16 at the time of elevating/lowering. Consequently, the wafer 3 can be grasped or leased at the edge thereof. Furthermore, the holding clamper 30 is arranged to rotate through a rotary drive section 14 and the notch or the orientation flat position of the wafer 3 is detected at a detecting section 40.</p>
申请公布号 JP2003100850(A) 申请公布日期 2003.04.04
申请号 JP20010289979 申请日期 2001.09.21
申请人 ASSIST JAPAN KK 发明人 KIRIHATA TADASHI
分类号 H01L21/68;H01L21/027;(IPC1-7):H01L21/68 主分类号 H01L21/68
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