发明名称 PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT
摘要 PROBLEM TO BE SOLVED: To enhance the workability of a semiconductor element by suppressing reflection loss greatly at a coaxial connector part at the time of inputting/ outputting a high frequency signal. SOLUTION: In the semiconductor package 1 comprising a basic body 2, a frame 3, and a coaxial connector 4, a through hole 8a made in the side part of the frame 3 has an enlarged inside diameter 9 on the outside of the frame 3. An annular space 10 is provided in the enlarged inside diameter 9 closely to the inside of the frame 3 and fitted with the coaxial connector 4. The annular space 10 has a length 10a of 0.05-0.15 mm in the direction of the central axis and an inside diameter 10b in the range of 50-120% of the outside diameter 11 of an insulator 4b.
申请公布号 JP2003100927(A) 申请公布日期 2003.04.04
申请号 JP20010289878 申请日期 2001.09.21
申请人 KYOCERA CORP 发明人 IINO MICHINOBU;HASHIMOTO TOSHIHIRO
分类号 H01L23/04;H01P5/08;(IPC1-7):H01L23/04 主分类号 H01L23/04
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