Verfahren zum Laserbohren, insbesondere unter Verwendung einer Lochmaske

摘要

The invention concerns a method for drilling holes in a circuit substrate (6) with a laser beam, using a perforated mask (8). According to said method, the laser beam (2) is displaced, in the zone of the perforated mask hole (10), along a circular path whereof the centre corresponds to that of the site intended for said hole, in the mask (8), and whereof the diameter (2XRI) is smaller than that (DM) of said hole. The diameter (DS) of the laser spot is such that it always cover the centre of the hole of the mask (8) during its circular movement, thereby providing laser energy distribution as uniformly as possible in the zone of the hole of the mask (8).