发明名称 |
Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device |
摘要 |
A resin composition for sealing a semiconductor device comprising (A) an epoxy resin; (B) a phenolic resin; and (C) a latent curing accelerator, wherein the resin composition is a solid at 25 DEG C or has a viscosity of not less than 400 Pa•s at 25 DEG C and of not more than 200 Pa•s at 80 DEG C; and a semiconductor device is obtained by mounting and sealing semiconductor elements on a wiring circuit substrate by using the resin composition. |
申请公布号 |
EP1184419(A3) |
申请公布日期 |
2003.04.02 |
申请号 |
EP20010119692 |
申请日期 |
2001.08.23 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
HARADA, TADAAKI |
分类号 |
C08G59/62;C08G59/18;C08L61/06;C08L63/00;H01L21/56;H01L23/29;H01L23/31 |
主分类号 |
C08G59/62 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|