发明名称 Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device
摘要 A resin composition for sealing a semiconductor device comprising (A) an epoxy resin; (B) a phenolic resin; and (C) a latent curing accelerator, wherein the resin composition is a solid at 25 DEG C or has a viscosity of not less than 400 Pa•s at 25 DEG C and of not more than 200 Pa•s at 80 DEG C; and a semiconductor device is obtained by mounting and sealing semiconductor elements on a wiring circuit substrate by using the resin composition.
申请公布号 EP1184419(A3) 申请公布日期 2003.04.02
申请号 EP20010119692 申请日期 2001.08.23
申请人 NITTO DENKO CORPORATION 发明人 HARADA, TADAAKI
分类号 C08G59/62;C08G59/18;C08L61/06;C08L63/00;H01L21/56;H01L23/29;H01L23/31 主分类号 C08G59/62
代理机构 代理人
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