发明名称 WAFER LIFT PIN
摘要 PURPOSE: A wafer lift pin is provided to minimize a loss of time by controlling and exchanging the height of the wafer lift pin without decoupling a chuck. CONSTITUTION: A wafer lift pin includes a support portion(110), a pin portion(140), and a combination portion(120). The first male screw is formed on a surface of the support portion(110) in order to fix the support portion(110) and a bellows. The first female screw is formed on an inner wall of the bellows. The support portion(110) has the thickness corresponding to the depth of a lower groove. A groove including the first female screw is formed on a center of an upper portion of the support portion(110) in order to fix the pin portion(140). The pint portion(140) has a cylindrical shape. The second male screw is formed at a lower portion of the pin portion(140). The second male screw is combined with the first female screw and the second female screw of a combination hole. The combination portion(120) is used for fixing the combination of the pin portion(140) and the support portion(110).
申请公布号 KR20030026059(A) 申请公布日期 2003.03.31
申请号 KR20010059043 申请日期 2001.09.24
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, JEONG HUI
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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