发明名称 THERMOELECTRIC COOLING MODULE
摘要 PROBLEM TO BE SOLVED: To make a thermal energy generated at a Peltier element uniform in a thermoelectric cooling module for controlling a temperature used for a humidity detecting sensor or the like. SOLUTION: The thermoelectric cooling module 1 comprises a plurality of the Peltier elements 2, copper plates 4 arranged on one end faces and other end faces of these elements 2 via solders 3, and first and second substrates 5, 6 fixed to the respective end face sides to control the temperature. In the module 1, heights of the elements 2 between the substrates 5 and 6 are lower at those disposed at an outside than those disposed at a central part of the substrates 5, 6, in such a manner that a difference is supplemented (absorbed) by a thickness of the solder 3 between the elements 2 and the plate 4 disposed between the substrates 5 and 6.
申请公布号 JP2003092434(A) 申请公布日期 2003.03.28
申请号 JP20010281631 申请日期 2001.09.17
申请人 MITSUBA CORP 发明人 FUJIO HIROBUMI;AOKI SHIGEKI;YODA TAKESHI;KAMIYAMA KATSUYA
分类号 H01L35/32;H01L35/08;(IPC1-7):H01L35/32 主分类号 H01L35/32
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