| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition free of thickening of resist lines, having high photosensitivity and less liable to contaminate a plating solution because a photoinitiator is hardly leached in the plating solution and to provide a photosensitive element. SOLUTION: The photosensitive resin composition comprises 100 pts.wt., in total, of (A) 40-80 pts.wt. polymer having carboxyl groups and (B) 20-60 pts.wt. polymerizable compound having at least one unsaturated bond, (C) 0.05-1 pt.wt. photoinitiator of formula (I) (where R<1> is a 6-12C alkylene) based on 100 pts.wt., in total, of the above (A) and (B), and (D) 0.1-3.0 pts.wt. hexaarylbiimidazole based on 100 pts.wt., in total, of the above (A) and (B). The photosensitive element is obtained by disposing a layer of the photosensitive resin composition on a support film. |
