发明名称 PHOTORESIST LAYER REMOVING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a photoresist layer removing device wherein a series of stages until cleaning and drying stages after photoresist is removed can be efficiently performed with low defect without immersing a glass substrate in a removing liquid chemical to ultrasonically remove the photoresist one by one, in a device for manufacturing a nickel stamper utilizing patterns of a groove and a pit formed on the glass substrate by a resist mask method. SOLUTION: In a method for manufacturing the nickel stamper comprising a stage for forming a lower layer 2 consisting of a water soluble resin layer and provided with a film thickness value equal to the depth value of the fine pattern of a stamper surface, a stage for etching the lower layer using a photoresist layer 3 formed on the lower layer as a mask and a stage for removing the photoresist layer by using the photoresist removing liquid chemical to form the glass substrate 1 provided with the lower layer having the fine pattern, a liquid ejecting nozzle 30 for dropping the photoresist removing liquid chemical which is ultrasonically vibrated onto the surface of the glass substrate while the glass substrate is rotated is provided as a means for removing the photoresist layer.
申请公布号 JP2003091885(A) 申请公布日期 2003.03.28
申请号 JP20010284164 申请日期 2001.09.18
申请人 RICOH CO LTD 发明人 KUDO YUZURU
分类号 G03F7/11;G03F7/40;G03F7/42;G11B7/26 主分类号 G03F7/11
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