| 摘要 |
PROBLEM TO BE SOLVED: To provide copper alloy foil which has high strength while maintaining high electrical conductivity of copper, and has satisfactory thermal peeling resistance even in surface treatment such as tinning. SOLUTION: The copper alloy foil has a composition containing, by weight, 0.01 to 0.3% Zn and 0.01 to 0.25% Zr or 0.02 to 0.4% Cr, and preferably containing one or more metals selected from Ti, Ni, Fe, Sn, Si, Mn, P, Mg, Co, Al, B, In and Ag by 0.005 to 1.0% in total as well, and the balance copper with inevitable impurities. The copper alloy foil is useful for a printed circuit board, a semiconductor package substrate, and a battery electrode board.
|
