发明名称 Conductive paste, method for manufacturing laminated ceraminc electronic component, and laminated ceramic electronic component
摘要 Provided is a Ag-based conductive paste for a terminal electrode which suppresses oxidation of the Ni surface of an internal conductor and therefore brings about excellent joining with Ni even when baking is performed in the atmosphere in the case where Ni is used as the internal conductor of a laminated ceramic electronic component. The conductive paste includes at least one of an Ag powder and an Ag alloy powder, a nickel boride powder, an inorganic binder and an organic vehicle, wherein the quantity of the nickel boride powder is within the range of about 5% by weight or more, but less than about 60% by weight of the total paste.
申请公布号 US2003060353(A1) 申请公布日期 2003.03.27
申请号 US20020247636 申请日期 2002.09.20
申请人 MIKI TAKESHI;NODA SATORU 发明人 MIKI TAKESHI;NODA SATORU
分类号 H01G4/12;C03C8/18;H01B1/16;H01B1/22;H01C7/02;H01G4/232;H01G4/30;(IPC1-7):H01B1/00;H01C1/00 主分类号 H01G4/12
代理机构 代理人
主权项
地址