发明名称 |
Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device |
摘要 |
A curable flux which works as a flux during soldering and as a reinforcing material for the soldered portion after being cured by heating; a resist for soldering which coats a circuit pattern having a land for placing solder balls and is cured by heating after the soldering; a semiconductor package and a semiconductor device in which the curable flux is used for soldering and the soldered portion is reinforced with the flux by heating; processes for producing a semiconductor package and a semiconductor device comprising using the curable flux for soldering and curing the curable flux after the soldering to reinforce the soldered portion. The curable flux works as a flux during bonding solder balls to the semiconductor package and soldering the package to a printed circuit board and reinforces the soldered portion after being cured by heating after the soldering.
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申请公布号 |
US2003060043(A1) |
申请公布日期 |
2003.03.27 |
申请号 |
US20020168645 |
申请日期 |
2002.06.24 |
申请人 |
HOSOMI TAKESHI;OKADA RYOUICHI;NAKAMURA KENSUKE;TAKAHASHI TOYOSEI |
发明人 |
HOSOMI TAKESHI;OKADA RYOUICHI;NAKAMURA KENSUKE;TAKAHASHI TOYOSEI |
分类号 |
B23K35/22;B23K35/36;H01L21/56;H01L21/60;H05K3/28;H05K3/34;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
B23K35/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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