| 摘要 |
In accordance with the present invention, a method is described which facilitates heat transfer from a silicon die after the silicon die is bonded to a substrate. An alignment tool is used to align the spacer with the silicon die. A thermal conductor can be placed on the silicon layer after the silicon layer has been bonded to the substrate layer. A die interface is not necessarily applied between the silicon die and the thermal conductor. A spacer is used between the substrate and the thermal conductor. The spacer can facilitate heat transfer from the die. The spacer can facilitate force transfer from the thermal lid to the die. The spacer allows a thermal conductor to be affixed to the silicon die without use of a die interface. An alignment tool is used to align the spacer with the silicon die.
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