发明名称 METHOD AND DEVICE FOR ARRAY SHAPE MACHINING, DIE FOR FORMING OPTICAL COMPONENT, AND OPTICAL COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an array shape machining method and device, which properly suppress rotary deflection of a rotary main shaft and accurately and easily align an array surface forming position of a workpiece with the rotary main shaft, and to provide a die for forming an optical component and the optical component. SOLUTION: The machining device 1 compensates for deviation of rotational balance of the rotary main spindle 2 resulting from the movement of the workpiece 8 by allowing a motor 13 to automatically move a dummy workpiece 9, which is held by a dummy holder 7 and has the same weight as the workpiece 8, over a pitch distance in a direction opposite to a moving direction of the workpiece 8 along a slide table 5 for the dummy via a ball screw 12 every time a motor 11 moves the workpiece 8 held by a workpiece holder 6 over the pitch distance along a slide table 4 for the workpiece via a ball screw 10. The machining device 1 thus corrects the deviation of the rotational balance of the rotary main shaft 2 with ease and performs easy, prompt and highly accurate machining to form array surfaces 20a, 20b, etc.
申请公布号 JP2003089030(A) 申请公布日期 2003.03.25
申请号 JP20010278445 申请日期 2001.09.13
申请人 RICOH CO LTD 发明人 CHO SUSUMU;INADA HISASHI;KAI SATOSHI
分类号 B23Q11/00;B24B13/005;(IPC1-7):B23Q11/00 主分类号 B23Q11/00
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