发明名称 |
Heat spreader having holes for rivet-like adhesive connections |
摘要 |
A heat spreader-package assembly is provided having a heat spreader mounted to a package board with an adhesive. The heat spreader has an upper portion and a plurality of sidewalls extending from the upper portion. The heat spreader has a flange that extends from the sidewalls continuously about a periphery of the upper portion and has a plurality of holes. The holes allow the uncured adhesive to flow therethrough. When the adhesive has cured, a head is formed from the adhesive on an upper side of the flange to establish a riveted connection.
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申请公布号 |
US6538320(B1) |
申请公布日期 |
2003.03.25 |
申请号 |
US20010892778 |
申请日期 |
2001.06.28 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
TOSAYA ERIC S.;ALCID EDWARD S. |
分类号 |
H01L21/50;H01L23/36;(IPC1-7):H01L23/10;H01L23/34 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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