发明名称 Heat spreader having holes for rivet-like adhesive connections
摘要 A heat spreader-package assembly is provided having a heat spreader mounted to a package board with an adhesive. The heat spreader has an upper portion and a plurality of sidewalls extending from the upper portion. The heat spreader has a flange that extends from the sidewalls continuously about a periphery of the upper portion and has a plurality of holes. The holes allow the uncured adhesive to flow therethrough. When the adhesive has cured, a head is formed from the adhesive on an upper side of the flange to establish a riveted connection.
申请公布号 US6538320(B1) 申请公布日期 2003.03.25
申请号 US20010892778 申请日期 2001.06.28
申请人 ADVANCED MICRO DEVICES, INC. 发明人 TOSAYA ERIC S.;ALCID EDWARD S.
分类号 H01L21/50;H01L23/36;(IPC1-7):H01L23/10;H01L23/34 主分类号 H01L21/50
代理机构 代理人
主权项
地址