发明名称 STRUCTURE OF CHIP RESISTOR AND MANUFACTURING METHOD THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To enable a chip resistor constituted by forming a resistor 13 and its glass-made cover coat 14 on an insulating substrate 12 and to provide terminal electrode 15 each of which is composed of a surface electrode 15a, a rear- face electrode 15b, a side-face electrode 15c, and an auxiliary surface electrode 15b at both ends of the substrate 12 and marks 16 indicating resistance values, etc., on the surface of the cover coat 14 to be mounted both in normal and in reverse, and at the same time, to improve the certainty and strength of soldering performed at the mounting of the resistor normally. SOLUTION: On the rear surface of the insulating substrate 12, a colored layer 17 colored in a dark color, such as black, etc., is formed so that parts of the rear-surface electrodes 15b lie upon both ends of the colored layer 17, and the marks 18 indicating resistance values, etc., are provided on the surface of the layer 17.</p>
申请公布号 JP2003086402(A) 申请公布日期 2003.03.20
申请号 JP20010276190 申请日期 2001.09.12
申请人 ROHM CO LTD 发明人 DOI MASATO;SAKANE HIDEKATSU
分类号 H01C17/02;H01C7/00;(IPC1-7):H01C7/00 主分类号 H01C17/02
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