发明名称 Method and apparatus for fabricating electronic device
摘要 Logic circuitry formed in street areas between adjacent fabricated electronic devices may be used as auxiliary or redundant components to salvage one or more otherwise defective devices. Logic circuitry is selectively coupled to the defective device(s) to directly replace or facilitate the replacement of defective components on one or more fabricated devices, thereby resulting in a single operable electronic device. The invention may be used to increase the production yield of electronic devices, particularly, semiconductor integrated circuits. The invention permits the fabrication of discretionary wiring during the normal metalization of semiconductor layers to interconnect electronic devices at the same time as the formation of the normal wiring/circuitry of the devices.
申请公布号 US2003054592(A1) 申请公布日期 2003.03.20
申请号 US20020259510 申请日期 2002.09.30
申请人 FARNWORTH WARREN M.;DUESMAN KEVIN G.;WOOD ALAN G. 发明人 FARNWORTH WARREN M.;DUESMAN KEVIN G.;WOOD ALAN G.
分类号 G01R31/26;H01L21/66;H01L21/82;H01L23/02;H01L23/58;H01L27/10;(IPC1-7):H01L21/82 主分类号 G01R31/26
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