Heat dissipation cover has cover thickness of device made up mainly of successive layers of different materials

摘要

The heat dissipation cover ha shaped for the heat source (8) to dissipate heat from it. Its thickness is made up basically of successive layers (2, 3, 4, 5, 6) of different conducting materials. These layers include at least one core layer (4, 5, 6) and/or a covering layer (2) on the heat source side and/or a covering layer (3) on the other side.