COF-TYPE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device and a semiconductor device manufactured according to the method wherein leads and bumps are aligned with high precision and superior reproducibility. SOLUTION: The semiconductor device comprises a semiconductor chip and a film for COF having leads formed on the main surface of an insulating base film with a space corresponding to external electrodes (pads) of the semiconductor chip. Through-holes are provided between the counterposed tips of inner leads of the leads on the film for COF.