| 摘要 |
PROBLEM TO BE SOLVED: To provide an element dividing method of a semiconductor laser element which can improve the operation efficiency of scribing without deteriorating workability and operation efficiency when an edge face protection film is formed. SOLUTION: The element dividing method of a semiconductor laser element comprises a process for dividing a semiconductor substrate, wherein a plurality of semiconductor laser elements are formed to be arranged into a matrix form, into a plurality of strip-like substrates for each line of a semiconductor laser element, a process for forming an edge face protection film which protects a division surface in the division surface of a divided substrate, a process for sticking a plurality of substrates, wherein edge face protection films are formed, on an adhesive sheet 6 spaced mutually in parallel so that a boundary between elements is arranged linearly, a process for forming a flaw for dividing in batch in the boundary arranged linearly and a process for dividing a substrate into each element based on the flaw by applying pressing force to a substrate having the flaw.
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