发明名称 POLISHING DEVICE
摘要 A polishing device for polishing the flat surface part of a polished material W by a polishing tape T, comprising a polishing device body having a tubular rotary drum 3 having a precisely finished outer peripheral surface, a tape reel 41, a wind-up reel 42 for winding up the polishing tape T, and the polishing tape T, the rotary drum 3 further comprising an outer peripheral surface having an axial length longer than that of the polished material W crossing the surface thereof, wherein a slit 32 allowing the polishing tape T to be inserted after the polishing tape T on the tape reel 41 located in the rotary drum 3 is pulled out onto the outer peripheral surface of the rotary drum 3 and wound by one turn on the outer peripheral surface of the rotary drum 3 is provided in the rotary drum 3 in the axial direction, and a polishing stand 6 comprising a slide mechanism 7 for sliding the polishing stand 6 relative to the rotary drum 3 in the direction orthogonal to the axial direction of the rotary drum 3 to bring the flat surface part of the polished material W on the polishing stand 6 into contact with the polishing tape T wound on the rotary drum 3 when the polishing stand is slid.
申请公布号 WO03022522(A1) 申请公布日期 2003.03.20
申请号 WO2002JP08387 申请日期 2002.08.20
申请人 NIHON MICRO COATING CO., LTD.;IMT CO., LTD.;MORIKAWA, KANAME;NAKATA, HIROMU 发明人 MORIKAWA, KANAME;NAKATA, HIROMU
分类号 B24B21/00;B24B7/22;H01L21/304;(IPC1-7):B24B21/00 主分类号 B24B21/00
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