Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses

摘要

Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with a heat spreading thermally-conductive cap of a mesh-like material which is interstitially the filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, which result in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.