| 摘要 |
The present invention, intended for providing a thermoforming system for film on blister packing machines realized in such a way as to form pockets without any extreme reduction of thickness of the sheet at the top face portion of the pocket, and enable to place the sheets one upon another without warping, is a thermoforming system for film for blister packaging machines, realized in such a way as to pinch and heat a film F, fed intermittently in synchronization with the open/close drive of the dies 5A, 5B on a thermoforming system, between the dies 5A, 5B of the thermoforming system, and partially extend said heated film F along the inner circumferential face of the pocket holes 52 of the forming die 5A to form pockets, characterized in that the dies of the thermoforming system are constructed with a forming die 5A provided with pocket holes 52, a heating die 5B provided with a plug 58 for locally heating only the pocket forming portion of the film F disposed facing the pocket hole 52 of the forming die 5A, and injecting mechanisms 53a, 55c of compressed air disposed on the forming die 5A side and the heating die 5B side, respectively.
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