INTEGRATED EMBOSS MODULE

摘要

The emboss module (2) of the present invention provides for automatic die and bolster conversion. The emboss module (2) includes a frame (100), a die changer sub-assembly (200) and a bolster sub-assembly (300). The die changer sub-assembly (200) includes rotatable die changers (202) for automatically registering dies therein, and the bolster sub-assembly (300) includes counters (400) and panels (502, 504) for receiving the sheet of material and the die. Both the die changer (202) and bolster sub-assemblies are adapted for use with emboss and foil dies and counters. Accordingly, a more efficient and scalable emboss system and method for automatically changing dies and bolsters is described herein.