| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part element whose yield can be improved and, to provide an electronic part device using the element. SOLUTION: An element electrode and a ground electrode 8 as an electrode pad which is electrically connected with the element electrode are formed on a piezoelectric substrate 3. An upper electrode 11 connected to an Au bump 10 and an intermediate electrode 12 formed between the ground electrode 8 and the upper electrode 11 are formed on the ground electrode 8. The upper electrode 11 is brought into contact with the intermediate electrode 12, is brought into contact with a first layer 11a constituted of an Al alloy and the Au bump 10, and has the two layer structure of a second layer 11b constituted of Al. |
