EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an epoxy resin composition that has excellent crack resistance and high adhesion and the semiconductor devices sealed with the cured product of the epoxy resin. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent and (C) a filler wherein (B) the curing agent is phenolic compounds bearing the recurring unit structures represented by specific chemical formulas (I) (wherein R1 -R4 are each H or methyl) and (II) (R5 -R8 are each H or methyl). In addition, the content of (C) the filler is 80-96 wt.% in the resin composition.