| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition giving a laminated board having excellent heat-resistance and bonding reliability by using an aromatic diamine as a curing agent, suppressing the lowering of the elastic modulus at a high temperature above the glass transition temperature and decreasing the change of a linear expansion coefficient (α2). SOLUTION: The epoxy resin composition contains an epoxy resin, an aromatic diamine, a cure accelerator, an alkaline aqueous solution and an epoxysilane expressed by general formula (1) (R1 is CH3 or C2 H5 ; and (m) is an integer of 0-8) as essential components. The addition amount of the epoxysilane is set to attain an SiO2 content of 10-20 wt.% calculated by the equation (1): SiO2 content = 60(1+m)/Mw}×χ/y (Mw is the molecular weight of the epoxysilane;χis the addition amount of the epoxysilane; and (y) is the weight of the solid content of total varnish excluding solvent). |
