| 摘要 |
A substrate processing apparatus consists of: a processing container; a first processing gas supply unit and a second processing gas supply unit, countering each other, prepared on both sides of a substrate-to-be-processed to the processing container; and a first slit-shaped exhaust opening and a second slit-shaped exhaust opening provided one on each side of the substrate-to-be-processed approximately perpendicular to the flow of the first processing gas and the second processing gas, countering the first processing gas supply unit and the second processing gas supply unit, respectively. The first processing gas is passed along the surface of the substrate-to-be-processed from the first processing gas supply unit to the first exhaust opening, and is adsorbed by the surface of the substrate-to-be-processed. Then, the second processing gas is passed along the surface of the substrate-to-be-processed from the second processing gas supply unit to the second exhaust opening, the second processing gas reacts with molecules of the first processing gas previously adsorbed, and a high dielectric film of a single-molecule layer is formed. <IMAGE>
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