SUBSTRATE LAMINATING APPARATUS, LAMINATED SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To solve the problem that thin plate glass is easily broken and cracked during a handling process and a defective product occurs frequently in a process for forming a device by laminating a thin plate glass substrate and an opposed glass substrate. SOLUTION: Thin plate glass (first substrate) is preliminarily bonded to a support substrate (second substrate) to form a laminated substrate and, after an electronic part (device) is formed from the laminate, the support substrate (second substrate) is peeled from the electronic part (device). At this time, fine grooves are formed to the surface of one substrate or a resin reducing pressure-sensitive adhesiveness by the irradiation with specific light is used on the surface of one substrate through a spacer to make the substrate easily peelable and the support substrate (second substrate) is reused to achieve cost reduction.