| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing use capable of forming a sealing resin with low coefficient of thermal expansion and high thermal conductivity, and having good moldability with slight molding defects including wire sweep. SOLUTION: This resin composition for sealing use comprises a resin, 85-95 mass% of a filler, and a curing promoter; wherein the filler consists of fused silica and alumina 30-60μm in mean particle size, and the curing promoter has a melting point of 150-350 deg.C. |
