发明名称 |
Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence |
摘要 |
The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion and causing greater plating of the cavity portion relative to the top portion. |
申请公布号 |
US6534116(B2) |
申请公布日期 |
2003.03.18 |
申请号 |
US20000740701 |
申请日期 |
2000.12.18 |
申请人 |
NUTOOL, INC. |
发明人 |
BASOL BULENT |
分类号 |
C25D5/02;C25D17/00;H01L21/288;H01L21/768;(IPC1-7):B05D5/12;B05D3/00;C25D5/18;C25D3/38 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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