发明名称 Arrangement for the temperature-compensated multi-dimensional micropositioning of mutually position-defined optical components
摘要 An arrangement for a temperature-compensated multi-dimensional micropositioning of mutually position-defined optical components including a guide unit for housing the optical components and a plurality of piezo actors. The guide unit includes two spaced plates or rings. Also included is three equally spaced solid joints arranged or integrated between the rings or plates, and stack-type piezo actors secured in a neighbouring relationship with the solid joints in such a manner that actuation forces act on the rings or plates. Further, at least the surfaces of the rings or plates accommodating the optical components are coated with a material corresponding to that of the optical components, the guide unit and the optical components are made from materials with essentially the same temperature coefficients, and one stack-type piezo actor is arranged between two solid joints.
申请公布号 US6534760(B2) 申请公布日期 2003.03.18
申请号 US20010880014 申请日期 2001.06.14
申请人 PHYSIK-INSTRUMENTS (PI) GMBH & CO. KG 发明人 MUELLER KLAUS-DIETER;MARTH HARRY
分类号 B23Q1/34;G02B7/00;G02B7/02;(IPC1-7):H01J5/16 主分类号 B23Q1/34
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