| 摘要 |
In a method of fabricating an integrated circuit chip, a circuit board unit is formed with a bore, a plurality of contact pads, and a plurality of positioning notches that correspond to the contact pads. A die is attached to a bottom surface of the circuit board unit, and solder pads on the die are wire-bonded to the contact pads using conductive wires that extend through the bore. Leads of a lead frame are inserted respectively into the positioning notches and are bonded to the contact pads. A plastic protective layer is then formed to encapsulate the circuit board unit and at least a portion of the lead frame.
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