发明名称 Method and apparatus for securing an electronic component
摘要 A securing apparatus is used to secure an electronic component, such as a thermoelectric cooler in a thermoelectric cooling system. The securing apparatus includes a clamping mechanism that clamps the electronic component between a first plate, such as a heat sink plate, and a second plate, such as a mounting plate. The clamping mechanism applies compression forces to the electronic component to secure the electronic component without using shear forces capable of damaging the electronic component. The clamping mechanism preferably provides thermal isolation between the heat sink plate and the mounting plate.
申请公布号 US6532746(B1) 申请公布日期 2003.03.18
申请号 US20020057246 申请日期 2002.01.24
申请人 TYCO TELECOMMUNICATIONS (US) INC. 发明人 BLOOM ELIOT;MAXHAM DAVID
分类号 F25B21/02;H01L23/38;H01L23/40;(IPC1-7):F25B21/02 主分类号 F25B21/02
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