HYDROGEN FLUXLESS SOLDERING BY ELECTRON ATTACHMENT

摘要

PURPOSE: A hydrogen fluxless soldering by electron attachment is provided to completely remove organic flux, have compatibleness with a continuous soldering creation line including reflow soldering and wave soldering, reduce the breakage rate of chips, and reduce the cost. CONSTITUTION: A dry fluxing method of metal surfaces of one or more components to be soldered comprises steps of providing one or more components(4) to be soldered which are connected to a first electrode(3) as a target assembly; providing a second electrode(2) adjacent to the target assembly; providing a gas mixture(6) comprising a reducing gas between the first and second electrodes; providing a direct current voltage to the first and second electrodes and donating electrons to the reducing gas to form negatively charged ionic reducing gas; and contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly.