发明名称 Structure incorporates relief carrying electrical connection formed as shaped layer of first conductive material coated with second conductive material of low resistivity
摘要 <p>A structure (100) incorporates at least one relief (16) before carrying at least one electrical connection (14) formed by a shaped layer (14.1) situated on the relief, in a first electrically conducting material. The shaped layer is coated with an additional layer (14.2) of a second electrically conducting material having a low resistivity. An Independent claim is also included for the production of the structure.</p>
申请公布号 FR2829626(A1) 申请公布日期 2003.03.14
申请号 FR20010016870 申请日期 2001.12.26
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE 发明人 DANEL JEAN SEBASTIEN
分类号 H01L21/768;H01L23/48;H01L23/482;(IPC1-7):H01R12/00;H05K3/32 主分类号 H01L21/768
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