发明名称 |
Structure incorporates relief carrying electrical connection formed as shaped layer of first conductive material coated with second conductive material of low resistivity |
摘要 |
<p>A structure (100) incorporates at least one relief (16) before carrying at least one electrical connection (14) formed by a shaped layer (14.1) situated on the relief, in a first electrically conducting material. The shaped layer is coated with an additional layer (14.2) of a second electrically conducting material having a low resistivity. An Independent claim is also included for the production of the structure.</p> |
申请公布号 |
FR2829626(A1) |
申请公布日期 |
2003.03.14 |
申请号 |
FR20010016870 |
申请日期 |
2001.12.26 |
申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE |
发明人 |
DANEL JEAN SEBASTIEN |
分类号 |
H01L21/768;H01L23/48;H01L23/482;(IPC1-7):H01R12/00;H05K3/32 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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