发明名称 SUBSTRATE-DRYING METHOD AND SUBSTRATE-DRYING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a substrate-drying method and substrate-drying equipment where the consumption of air can be reduced and irregularities of drying can be restrained. SOLUTION: The quantity of air spouted from air knives 53a, 53b is made greater than that of the time of waiting, and treatment liquid stuck on a region Ga in the vicinity of a front end of a substrate G is removed. After a prescribed time has passed starting from when a sensor S detects the front end of the substrate, at a region Gc except the regions in the vicinities of the front end and a rear end of the substrate, air is spouted whose spouting quantity is smaller than that of the region Ga, and the treatment liquid is removed. After a prescribed time has passed again from when the sensor S detects the front end of the substrate, the treatment liquid stuck on a region Gb in the vicinity of the rear end of the substrate G is removed. As a result, the removal is enabled completely all over the whole surface of the substrate without generating irregularities, and the generation of drying nonuniformity can be prevented. Further, the spouting quantity of air in the region Gc can be reduced.
申请公布号 JP2003077883(A) 申请公布日期 2003.03.14
申请号 JP20010268424 申请日期 2001.09.05
申请人 TOKYO ELECTRON LTD 发明人 SHINOZAKI MASAYA;SADA TETSUYA;NAKAMITSU TAKASHI;TSURUTA SHIGETO
分类号 F26B5/14;F26B9/06;F26B15/12;H01L21/304;(IPC1-7):H01L21/304 主分类号 F26B5/14
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